Part Number Hot Search : 
CAT24 PHP36N06 045CT LC100 AOZ1020 TN1177 RT9701CB AN110
Product Description
Full Text Search
 

To Download TSC2000 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  www.ti.com production data information is current as of publication date. products conform to specifications per the terms of texas instruments standard warranty. production processing does not necessarily include testing of all parameters. copyright ?2002, texas instruments incorporated please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. features  4-wire touch screen interface  ratiometric conversion  single 2.7v to 3.6v supply  serial interface  internal detection of screen touch  programmable 8-, 10-, or 12-bit resolution  programmable sampling rates  direct battery measurement (0.5v to 6v)  on-chip temperature measurement  touch-pressure measurement  full power-down control  tssop-20 package applications  personal digital assistants  cellular phones  mp3 players pda analog interface circuit description the TSC2000 is a complete pda analog interface circuit. it contains a complete 12-bit, analog-to-digital (a/d) resistive touch screen converter including drivers, the control to mea- sure touch pressure, and an 8-bit digital-to-analog (d/a) converter output for lcd contrast control. the TSC2000 interfaces to the host controller through a standard spi serial interface. the TSC2000 offers programmable resolution and sampling rates from 8- to 12-bits and up to 125khz to accommodate different screen sizes. the TSC2000 also offers two battery-measurement inputs, one of which is capable of reading battery voltages up to 6v while operating at only 2.7v. it also has an on-chip temperature sensor capable of reading 0.3 c resolution. the TSC2000 is available in a tssop-20 package. TSC2000 sbas257 ?february 2002 spi is a registered trademark of motorola. us patent no. 624639. a/d converter internal 2.5v reference mux serial interface and control logic d/a converter miso ss sclk mosi dav penirq touch panel drivers temp sensor battery monitor battery monitor x+ x y+ y v bat1 v bat2 clock aux1 aux2 v ref arng a out t s c 2 0 0 0
2 www.ti.com TSC2000 sbas257 absolute maximum ratings (1) v dd to gnd ........................................................................... 0.3v to +6v digital input voltage to gnd ................................... 0.3v to v dd + 0.3v operating temperature range ...................................... 40 c to +105 c storage temperature range ......................................... 65 c to +150 c junction temperature (t j max) .................................................... +150 c tssop package power dissipation .................................................... (t j max t a )/ ja ja thermal impedance .......................................................... 93 c/w lead temperature, soldering vapor phase (60s) ............................................................ +215 c infrared (15s) ..................................................................... +220 c note: (1) stresses above those listed under absolute maximum ratings may cause permanent damage to the device. exposure to absolute maximum conditions for extended periods may affect device reliability. integral specified linearity package temperature package ordering transport product error (lsb) package-lead designator (1) range marking number (2) media, quantity TSC2000ipw 2 tssop-20 pw 40 c to +85 c TSC2000i TSC2000ipw rails, 70 "" " " " " TSC2000ipwr tape and reel, 2000 notes: (1) for the most current specifications and package information, refer to our web site at www.ti.com. (2) models labeled with r indicates large quantity tape and reel. pin configuration top view tssop pin description pin name description 1v dd power supply 2 x+ x+ position input 3 y+ y+ position input 4x x position input 5y y position input 6 gnd ground 7v bat1 battery monitor input 1 8v bat2 battery monitor input 2 9v ref voltage reference input/output 10 nc no connection 11 sclk serial clock input 12 ss slave select input (active low). data will not be clocked in to mosi unless ss is low. when ss is high, miso is high impedance. 13 mosi serial data input. data is clocked in at sclk falling edge. 14 dav data available (active low) 15 miso serial data output. data is clocked out at sclk falling edge. high impedance when ss is high. 16 penirq pen interrupt 17 a out analog output current from d/a converter 18 arng d/a converter analog output range set 19 aux2 auxiliary a/d converter input 2 20 aux1 auxiliary a/d converter input 1 electrostatic discharge sensitivity this integrated circuit can be damaged by esd. texas instruments recommends that all integrated circuits be handled with appropriate precautions. failure to observe proper han- dling and installation procedures can cause damage. esd damage can range from subtle performance degrada- tion to complete device failure. precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. +v dd x+ y+ x y gnd v bat1 v bat2 v ref nc aux1 aux2 arng a out penirq miso dav mosi ss sclk 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 TSC2000
3 www.ti.com TSC2000 sbas257 parameter conditions min typ max units auxiliary analog input input voltage range 0+v ref v input capacitance 25 pf input leakage current 1 a battery monitor input input voltage range vbat1 0.5 6.0 v input voltage range vbat2 0.5 3.0 v input capacitance 25 pf input leakage current 1 a accuracy 3+3% temperature measurement temperature range 40 +85 c temperature resolution 0.3 c accuracy 2 c a/d converter resolution programmable: 8-, 10-, or 12-bits 12 bits no missing codes 12-bit resolution 11 bits integral linearity 2lsb offset error 6lsb gain error excluding reference error 6lsb noise 30 vrms power-supply rejection 80 db d/a converter output current range set by resistor from arng to gnd 650 a resolution 8 bits integral linearity 2lsb voltage reference voltage range internal 2.5v 2.45 2.5 2.55 v internal 1.25v 1.225 1.25 1.275 v reference drift 20 ppm/ c external reference input range 1.0 v dd v current drain external reference 20 a digital input/output internal clock frequency 8mhz logic family cmos logic levels: v ih i ih = +5 a0.7v dd v v il i il = +5 a 0.3 0.3v dd v v oh i oh = 2 ttl loads 0.8v dd v v ol i ol = 2 ttl loads 0.4 v power-supply requirements power-supply voltage, +v dd specified performance 2.7 3.6 v quiescent current see note (1) 1.25 2.3 ma see note (2) 500 a power down 3 a temperature range specified performance 40 +85 c notes: (1) aux1 conversion, no averaging, no ref power down, 50 s conversion. (2) aux1 conversion, no averaging, external reference , 50 s conversion. electrical characteristics at 40 c to +85 c, +v dd = +2.7v, internal v ref = +2.5v, conversion clock = 2mhz, 12-bit mode, unless otherwise noted. TSC2000ipw
4 www.ti.com TSC2000 sbas257 timing diagram all specifications typical at 40 c to +85 c, +v dd = +2.7v. t td t lag t dis t lead t sck t wsck t wsck t hi t su t ho t a t v t r t f ss sclk msb out msb in lsb in lsb out bit 6 ... 1 bit 6 ... 1 miso mosi parameter conditions min typ max units sclk period t sck 30 ns enable lead time t lead 15 ns enable lag time t lag 15 ns sequential transfer delay t td 30 ns data setup time t su 10 ns data hold time (inputs) t hi 10 ns data hold time (outputs) t ho 0ns slave access time t a 15 ns slave d out disable time t dis 15 ns datavalid t v 10 ns rise time t r 30 ns fall time t f 30 ns timing characteristics (1)(2) at 40 c to +85 c, +v dd = +2.7v, v ref = +2.5v, unless otherwise noted. TSC2000 notes: (1) all input signals are specified with t r = t f = 5ns (10% to 90% of v dd ) and timed from a voltage level of (v il + v ih )/2. (2) see timing diagram below.
5 www.ti.com TSC2000 sbas257 typical characteristics at t a = +25 c, +v dd = +2.7v, conversion clock = 2mhz, 12-bit mode. internal v ref = +2.5v, unless otherwise noted. conversion supply current vs temperature (aux1 conversion, no averaging, no ref power-down, 20 s conversion) 0 60 100 40 20 20 temperature ( c) i dd (ma) 2 1.95 1.9 1.85 1.8 1.75 40 60 80 power-down supply current vs temperature 0 60 100 40 20 20 temperature ( c) i dd (na) 7 6 5 4 3 2 1 0 40 60 80 power-down supply current vs supply voltage 2.9 2.5 3.7 3.1 supply voltage (v) power-down current (na) 0.12 0.11 0.1 0.09 0.08 0.07 0.06 3.3 3.5 2.7 internal oscillator frequency vs v dd 3.1 2.5 3.7 2.7 3.3 v dd (v) internal oscillator frequency (mhz) 8.3 8.25 8.2 8.15 8.1 8.05 8 7.95 7.9 7.85 7.8 3.5 2.9 change in gain error vs temperature 0 60 100 40 20 20 temperature ( c) change in gain error (lsb) 0.5 0.4 0.3 0.2 0.1 0 0.1 0.2 0.3 0.4 0.5 40 60 80 change in offset error vs temperature 0 60 100 40 20 20 temperature ( c) change in offset (lsb) 40 60 80 0.5 0.4 0.3 0.2 0.1 0 0.1 0.2 0.3 0.4 0.5
6 www.ti.com TSC2000 sbas257 typical characteristics (cont.) at t a = +25 c, +v dd = +2.7v, conversion clock = 2mhz, 12-bit mode. internal v ref = +2.5v, unless otherwise noted. internal reference vs temperature 20 40 60 100 40 20 0 60 80 temperature ( c) v ref (v) 2.55 2.54 2.53 2.52 2.51 2.5 2.49 2.48 2.47 2.46 2.45 v ref (v) 1.275 1.27 1.265 1.26 1.255 1.25 1.245 1.24 1.235 1.23 1.225 2.5v reference 1.25v reference internal reference vs v dd 3.3 3.5 2.5 3.7 2.7 2.9 3.1 v dd (v) v ref (v) 2.55 2.54 2.53 2.52 2.51 2.5 2.49 2.48 2.47 2.46 2.45 v ref (v) 1.275 1.27 1.265 1.26 1.255 1.25 1.245 1.24 1.235 1.23 1.225 2.5v reference 1.25v reference internal oscillator frequency vs temperature 0 60 100 40 20 20 temperature ( c) internal oscillator frequency (mhz) 8.4 8.2 8 7.8 7.6 7.4 7.2 40 60 80 touchscreen driver on-resistance vs temperature 0 60 100 40 20 20 temperature ( c) resistance ( ? ) 8 7.5 7 6.5 6 5.5 5 4.5 4 40 60 80 touch screen driver on-resistance vs v dd 3.1 2.5 3.7 2.7 3.3 supply voltage (v) on-resistance ( ? ) 7 6.9 6.8 6.7 6.6 6.5 6.4 6.3 6.2 6.1 3.5 2.9 temp1 diode voltage vs temperature 0 60 100 40 20 20 temperature ( c) voltage (mv) 800 750 700 650 600 550 500 450 400 40 60 80
7 www.ti.com TSC2000 sbas257 typical characteristics (cont.) at t a = +25 c, +v dd = +2.7v, conversion clock = 2mhz, 12-bit mode. internal v ref = +2.5v, unless otherwise noted. 900 800 700 600 500 voltage (mv) temperature ( c) 60 40 20 0 20 40 60 80 100 temp2 diode voltage vs temperature temp1 diode voltage vs v dd 3.1 2.5 3.7 2.7 3.3 v dd (v) temp1 voltage (mv) 612.0 611.8 611.6 611.4 611.2 611.0 610.8 610.6 610.4 610.2 610.0 3.5 2.9 temp2 diode voltage vs v dd 3.1 2.5 3.7 2.7 3.3 v dd (v) temp2 voltage (mv) 740 738 736 734 732 730 728 726 724 722 720 3.5 2.9 dac output current vs temperature 0 60 100 40 20 20 temperature ( c) dac output current (ma) 1 0.95 0.9 0.85 0.8 0.75 0.7 0.65 0.6 40 60 80 dac max current vs v dd 3.1 2.5 3.7 2.7 3.3 v dd (v) dac output current (ma) 0.91 0.905 0.9 0.895 0.89 0.885 0.88 0.875 3.5 2.9
8 www.ti.com TSC2000 sbas257 figure 1. typical circuit configuration. overview the TSC2000 is an analog interface circuit for human inter- face devices. a register-based architecture eases integration with microprocessor-based systems through a standard spi bus. all peripheral functions are controlled through the reg- isters and onboard state machines. the TSC2000 consists of the following blocks (refer to the block diagram on the front page): touch screen interface battery monitors auxiliary inputs temperature monitor current output d/a converter communication to the TSC2000 is via a standard spi serial interface. this interface requires that the slave select signal be driven low to communicate with the TSC2000. data is then shifted into or out of the TSC2000 under control of the host microprocessor, which also provides the serial data clock. control of the TSC2000 and its functions is accomplished by writing to different registers in the TSC2000. a simple com- mand protocol is used to address the 16-bit registers. reg- isters control the operation of the a/d converter and d/a converter. the result of measurements made will be placed in the TSC2000 s memory map and may be read by the host at any time. three signals are available from the TSC2000 to indicate that data is available for the host to read. the dav output indicates that an a/d conversion has completed and that data is available. the penirq output indicates that a touch has been detected on the touch screen. a typical application of the TSC2000 is shown in figure 1. + auxiliary input auxiliary input pen interrupt request serial data out data available serial data in slave select serial clock 1 f to 10 f (optional) +2.7v to +3.3v touch screen 0.1 f +v dd x+ y+ x y gnd v bat1 v bat2 v ref nc aux1 aux2 arng a out penirq miso dav mosi ss sclk 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 TSC2000 + 1 f to 10 f (optional) 0.1 f main battery secondary battery lcd contrast voltage regulator rrng
9 www.ti.com TSC2000 sbas257 figure 2. 4-wire touch screen construction. figure 3. pressure measurement. operation touch screen a resistive touch screen works by applying a voltage across a resistor network and measuring the change in resistance at a given point on the matrix where a screen is touched by an input stylus, pen, or finger. the change in the resistance ratio marks the location on the touch screen. the TSC2000 supports the resistive 4-wire configurations (see figure 1). the circuit determines location in two coordi- nate pair dimensions, although a third dimension can be added for measuring pressure. the 4-wire touch screen coordinate pair measurement a 4-wire touch screen is constructed as shown in figure 2. it consists of two transparent resistive layers separated by insulating spacers. the 4-wire touch screen panel works by applying a voltage across the vertical or horizontal resistive network. the a/d converter converts the voltage measured at the point the panel is touched. a measurement of the y-position of the pointing device is made by connecting the x+ input to a data converter chip, turning on the y+ and y drivers, and digitizing the voltage seen at the x+ input. the voltage measured is determined by the voltage divider developed at the point of touch. for this measurement, the horizontal panel resistance in the x+ lead does not affect the conver- sion due to the high input impedance of the a/d converter. voltage is then applied to the other axis, and the a/d converter converts the voltage representing the x-position on the screen. this provides the x- and y-coordinates to the associated processor. measuring touch pressure (z) can also be done with the TSC2000. to determine pen or finger touch, the pressure of the touch needs to be determined. generally, it is not necessary to have very high performance for this test, there- fore, the 8-bit resolution mode is recommended (however, calculations will be shown with the 12-bit resolution mode). there are several different ways of performing this measure- ment. the TSC2000 supports two methods. the first method requires knowing the x-plate resistance, measurement of the x-position, and two additional cross panel measurements (z 2 and z 1 ) of the touch screen, as seen in figure 3. using equation 1 will calculate the touch resistance: rr x-position 4096 z z 1 touch x-plate 2 1 = ? ? ? ? ? ? ? (1) the second method requires knowing both the x-plate and y-plate resistance, measurement of x-position and y-posi- tion, and z 1 . using equation 2 will also calculate the touch resistance: (2) rr x-position 4096 4096 z 1r y-position 4096 touch x-plate 1 -plate = ? ? ? ? ? ? ? ?? y when the touch panel is pressed or touched, and the drivers to the panel are turned on, the voltage across the touch panel will often overshoot and then slowly settle (decay) down to a stable dc value. this is due to mechanical bouncing which is caused by vibration of the top layer sheet of the touch panel when the panel is pressed. this settling time must be accounted for, or else the converted value will be in error. therefore, a delay must be introduced between the time the driver for a particular measurement is turned on, and the time measurement is made. conductive bar insulating material (glass) silver ink transparent conductor (ito) bottom side transparent conductor (ito) top side x+ x y+ y ito = indium tin oxide x-position measure x-position measure z 1 -position touch x+ y+ x y z 1 -position touch x+ y+ y x measure z 2 -position z 2 -position touch x+ y+ y x
10 www.ti.com TSC2000 sbas257 figure 4. simplified diagram of the analog input section. in some applications, external capacitors may be required across the touch screen for filtering noise picked up by the touch screen; i.e., noise generated by the lcd panel or back-light circuitry. the value of these capacitors will provide a low-pass filter to reduce the noise, but will cause an additional settling time requirement when the panel is touched. several solutions to this problem are available in the TSC2000. a programmable delay time is available which sets the delay between turning the drivers on and making a conversion. this is referred to as the panel voltage stabilization time, and is used in some of the modes available in the TSC2000. in other modes, the TSC2000 can be commanded to turn on the drivers only without performing a conversion. time can then be allowed before a conversion is started. the TSC2000 touch screen interface can measure position (x and y) and pressure (z). determination of these coordinates is possible under three different modes of the a/d converter: conversion controlled by the TSC2000, initiated by detection of a touch; conversion controlled by the TSC2000, initiated by the host responding to the penirq signal; or conversion com- pletely controlled by the host processor. a/d converter the analog inputs of the TSC2000 are shown in figure 4. the analog inputs (x, y, and z touch panel coordinates, battery voltage monitors, chip temperature, and auxiliary inputs) are provided via a multiplexer to the successive approximation register (sar) a/d converter. the a/d converter architecture is based on capacitive redistribution architecture which inher- ently includes a sample-and-hold function. converter ref +ref +in in v bat1 aux1 battery on aux2 gnd 2.5v reference ref on/off x+ x +v dd temp1 y+ y v ref temp0 7.5k ? v bat2 2.5k ? 2.5k ? battery on 2.5k ?
11 www.ti.com TSC2000 sbas257 figure 5. ideal input voltages and output codes. figure 6. penirq functional block diagram. a unique configuration of low on-resistance switches allows an unselected a/d converter input channel to provide power and an accompanying pin to provide ground for driving the touch panel. by maintaining a differential input to the con- verter and a differential reference input architecture, it is possible to negate errors caused by the driver switch on- resistances. the a/d converter is controlled by an a/d converter control register. several modes of operation are possible, depend- ing upon the bits set in the control register. channel selec- tion, scan operation, averaging, resolution, and conversion rate may all be programmed through this register. these modes are outlined in the sections below for each type of analog input. the results of conversions made are stored in the appropriate result register. data format the TSC2000 output data is in straight binary format, as shown in figure 5. this figure shows the ideal output code for the given input voltage and does not include the effects of offset, gain, or noise. reference the TSC2000 has an internal voltage reference that can be set to 1.25v or 2.5v, through the reference control register. the internal reference voltage is only used in the single- ended mode for battery monitoring, temperature measure- ment, and for utilizing the auxiliary inputs. optimal touch screen performance is achieved when using a ratiometric conversion, thus all touch screen measurements are done automatically in the differential mode. an external reference can also be applied to the v ref pin, and the internal refer- ence can be turned off. variable resolution the TSC2000 provides three different resolutions for the a/d converter: 8-, 10-, or 12-bits. lower resolutions are often practical for measurements such as touch pressure. perform- ing the conversions at lower resolutions reduces the amount of time it takes for the a/d converter to complete its conversion process, which lowers power consumption. conversion clock and conversion time the TSC2000 contains an internal 8mhz clock, which is used to drive the state machines inside the device that perform the many functions of the part. this clock is divided down to provide a clock to run the a/d converter. the division ratio for this clock is set in the a/d converter control register. the ability to change the conversion clock rate allows the user to choose the optimal value for resolution, speed, and power. if the 8mhz clock is used directly, the a/d converter is limited to 8-bit resolution; using higher resolutions at this speed will not result in accurate conversions. using a 4mhz conversion clock is suitable for 10-bit resolution; 12-bit resolution requires that the conversion clock run at 1mhz or 2mhz. regardless of the conversion clock speed, the internal clock will run nominally at 8mhz. the conversion time of the TSC2000 is dependent upon several functions. while the conversion clock speed plays an important role in the time it takes for a conversion to complete, a certain number of internal clock cycles is needed for proper sampling of the signal. moreover, additional times, such as the panel voltage stabilization time, can add significantly to the time it takes to perform a conversion. conversion time can vary depending upon the mode in which the TSC2000 is used. throughout this data sheet, internal and conversion clock cycles will be used to describe the times that many functions take. in considering the total system design, these times must be taken into account by the user. touch detect the pen interrupt ( penirq ) output function is detailed in figure 6. while in the power-down mode, the y driver is on and connected to gnd and the penirq output is connected to the x+ input. when the panel is touched, the x+ input is output code 0v fs = full-scale voltage = v ref (1) 1lsb = v ref (1) /4096 fs 1lsb 11...111 11...110 11...101 00...010 00...001 00...000 1lsb notes: (1) reference voltage at converter: +ref ( ref). see figure 4. (2) input voltage at converter, after multiplexer: +in ( in). see figure 4. input voltage (2) (v) v dd v dd 50k ? on y+ or x+ drivers on, or temp1, temp2 measurements activated. y+ x+ y high except when temp1, temp2 activated penirq temp2 temp1 temp diode
12 www.ti.com TSC2000 sbas257 msb lsb bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 r/w pg3 pg2 pg1 pg0 addr5 addr4 addr3 addr2 addr1 addr0 x x x x x table i. TSC2000 command word. pg3 pg2 pg1 pg0 page addressed 0000 0 0001 1 0 0 1 0 reserved 0 0 1 1 reserved 0 1 0 0 reserved 0 1 0 1 reserved 0 1 1 0 reserved 0 1 1 1 reserved 1 0 0 0 reserved 1 0 0 1 reserved 1 0 1 0 reserved 1 0 1 1 reserved 1 1 0 0 reserved 1 1 0 1 reserved 1 1 1 0 reserved 1 1 1 1 reserved table ii. page addressing. pulled to ground through the touch screen and penirq output goes low due to the current path through the panel to gnd, initiating an interrupt to the processor. during the measurement cycles for the x- and y-positions, the x+ input will be disconnected from the penirq pull-down transistor to eliminate any leakage current from the pull-up resistor to flow through the touch screen, thus causing no errors. in modes where the TSC2000 needs to detect if the screen is still touched (for example, when doing a penirq -initiated x, y, and z conversion), the TSC2000 must reset the drivers so that the 50k ? resistor is connected again. due to the high value of this pull-up resistor, any capacitance on the touch screen inputs will cause a long delay time, and may prevent the detection from occurring correctly. to prevent this, the TSC2000 has a circuit which allows any screen capacitance to be precharged , so that the pull-up resistor doesn t have to be the only source for the charging current. the time allowed for this precharge, as well as the time needed to sense if the screen is still touched, can be set in the configuration control register. this illustrates the need to use the minimum capacitor values possible on the touch screen inputs. these capacitors may be needed to reduce noise, but too large a value will increase the needed precharge and sense times, as well as panel voltage stabilization time. digital interface the TSC2000 communicates through a standard spi bus. the spi allows full-duplex, synchronous, serial communica- tion between a host processor (the master) and peripheral devices (slaves). the spi master generates the synchroniz- ing clock and initiates transmissions. the spi slave devices depend on a master to start and synchronize transmissions. a transmission begins when initiated by a master spi. the byte from the master spi begins shifting in on the slave mosi pin under the control of the master serial clock. as the byte shifts in on the mosi pin, a byte shifts out on the miso pin to the master shift register. the idle state of the serial clock for the TSC2000 is low, which corresponds to a clock polarity setting of 0 (typical microprocessor spi control bit cpol = 0). the TSC2000 interface is designed so that with a clock phase bit setting of 1 (typical microprocessor spi control bit cpha = 1), the master begins driving its mosi pin and the slave begins driving its miso pin on the first serial clock edge. the ss pin should idle high between transmissions. the TSC2000 will only interpret command words which are transmitted after the falling edge of ss . TSC2000 communication protocol the TSC2000 is entirely controlled by registers. reading and writing these registers is accomplished by the use of a 16-bit command, which is sent prior to the data for that register. the command is constructed as shown in table i. the command word begins with a r/w bit, which specifies the direction of data flow on the serial bus. the following four bits specify the page of memory this command is directed to, as shown in table ii. the next six bits specify the register address on that page of memory to which the data is directed. the last five bits are reserved for future use.
13 www.ti.com TSC2000 sbas257 addr register 00 x 01 y 02 z 1 03 z 2 04 reserved 05 bat1 06 bat2 07 aux1 08 aux2 09 temp1 0a temp2 0b dac 0c reserved 0d reserved 0e reserved 0f reserved 10 zero 11 reserved 12 reserved 13 reserved 14 reserved 15 reserved 16 reserved 17 reserved 18 reserved 19 reserved 1a reserved 1b reserved 1c reserved 1d reserved 1e reserved 1f reserved page 0: data registers page 1: control registers addr register 00 adc 01 reserved 02 dacctl 03 ref 04 reset 05 config 06 reserved 07 reserved 08 reserved 09 reserved 0a reserved 0b reserved 0c reserved 0d reserved 0e reserved 0f reserved 10 reserved 11 reserved 12 reserved 13 reserved 14 reserved 15 reserved 16 reserved 17 reserved 18 reserved 19 reserved 1a reserved 1b reserved 1c reserved 1d reserved 1e reserved 1f reserved table iii. TSC2000 memory map. figure 7. write and read operation of TSC2000 interface. write operation read operation command word command word data data data ss sclk mosi miso to read all the first page of memory, for example, the host processor must send the TSC2000 the command 8000 h this specifies a read operation beginning at page 0, address 0. the processor can then start clocking data out of the TSC2000. the TSC2000 will automatically increment its address pointer to the end of the page; if the host processor continues clocking data out past the end of a page, the TSC2000 will simply send back the value ffff h . likewise, writing to page 1 of memory would consist of the processor writing the command 0800 h , which would specify a write operation, with pg0 set to 1, and all the addr bits set to 0. this would result in the address pointer pointing at the first location in memory on page 1. see the TSC2000 memory map section for details of register locations. figure 7 shows an example of a complete data transaction between the host processor and the TSC2000. TSC2000 memory map the TSC2000 has several 16-bit registers which allow control of the device as well as providing a location for results from the TSC2000 to be stored until read by the host microprocessor. these registers are separated into two pages of memory in the TSC2000: a data page (page 0) and a control page (page 1). the memory map is shown in table iii.
14 www.ti.com TSC2000 sbas257 reset addr register value page (hex) name d15 d14 d13 d12 d11 d10 d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 (hex) 0 00 x 0 0 0 0 r11 r10 r9 r8 r7 r6 r5 r4 r3 r2 r1 r0 0000 0 01 y 0 0 0 0 r11 r10 r9 r8 r7 r6 r5 r4 r3 r2 r1 r0 0000 002 z 1 0 0 0 0 r11 r10 r9 r8 r7 r6 r5 r4 r3 r2 r1 r0 0000 003 z 2 0 0 0 0 r11 r10 r9 r8 r7 r6 r5 r4 r3 r2 r1 r0 0000 0 04 reserved 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0000 0 05 bat1 0 0 0 0 r11 r10 r9 r8 r7 r6 r5 r4 r3 r2 r1 r0 0000 0 06 bat2 0 0 0 0 r11 r10 r9 r8 r7 r6 r5 r4 r3 r2 r1 r0 0000 0 07 aux1 0 0 0 0 r11 r10 r9 r8 r7 r6 r5 r4 r3 r2 r1 r0 0000 0 08 aux2 0 0 0 0 r11 r10 r9 r8 r7 r6 r5 r4 r3 r2 r1 r0 0000 0 09 temp1 0 0 0 0 r11 r10 r9 r8 r7 r6 r5 r4 r3 r2 r1 r0 0000 0 0a temp2 0 0 0 0 r11 r10 r9 r8 r7 r6 r5 r4 r3 r2 r1 r0 0000 0 0b dac x x x x x x x x d7 d6 d5 d4 d3 d2 d1 d0 007f 0 0c reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 0 0d reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 0 0e reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 0 0f reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 0 10 zero 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0000 0 11 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 0 12 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 0 13 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 0 14 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 0 15 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 0 16 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 0 17 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 0 18 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 0 19 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 0 1a reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 0 1b reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 0 1c reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 0 1d reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 0 1e reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 0 1f reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 00 adc psm sts ad3 ad2 ad1 ad0 rs1 rs0 av1 av0 cl1 cl0 pv2 pv1 pv0 x 4000 1 01 reserved 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 4000 1 02 dacctl dpd 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 8000 1 03 ref x x x x x x x x x x x int dl1 dl0 pnd rfv 0002 1 04 reset 1 0 1 1 1 0 1 1 x x x x x x x x ffff 1 05 config 1 1 1 1 1 1 1 1 1 1 pr2 pr1 pr0 sn2 sn1 sn0 ffc0 1 06 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 07 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 08 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 09 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 0a reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 0b reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 0c reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 0d reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 0e reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 0f reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 10 reserved 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0000 1 11 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 12 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 13 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 14 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 15 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 16 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 17 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 18 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 19 reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 1a reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 1b reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 1c reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 1d reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 1e reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff 1 1f reserved 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 ffff note: x = don t care. table iv. register summary for TSC2000. TSC2000 control registers this section will describe each of the registers that were shown in the memory map of table iii. the registers are grouped according to the function they control. note that in the TSC2000, bits in control registers may refer to slightly different functions depending upon if you are reading the register or writing to it. a summary of all registers and bit locations is shown in table iv.
15 www.ti.com TSC2000 sbas257 table vii. sts bit operation. sts read/write value description read 0 converter is busy read 1 conversions are complete, data is available write 0 normal operation write 1 stop conversion and power down a/d3 a/d2 a/d1 a/d0 function 0 0 0 0 invalid. no registers will be updated. this is the default state after a reset. 0 0 0 1 touch screen scan function: x and y coordinates converted and the results returned to x and y data registers. scan continues until either the pen is lifted or a stop bit is sent. 0 0 1 0 touch screen scan function: x, y, z 1 , and z 2 coordinates converted and the results returned to x, y, z 1 , and z 2 data registers. scan continues until either the pen is lifted or a stop bit is sent. 0 0 1 1 touch screen scan function: x coordinate converted and the results returned to x data register. 0 1 0 0 touch screen scan function: y coordinate converted and the results returned to y data register. 0 1 0 1 touch screen scan function: z 1 and z 2 coordinates converted and the results returned to z 1 and z 2 data registers. 0 1 1 0 battery input 1 converted and the results returned to the bat1 data register. 0 1 1 1 battery input 2 converted and the results returned to the bat2 data register. 1 0 0 0 auxiliary input 1 converted and the results returned to the aux1 data register. 1 0 0 1 auxiliary input 2 converted and the results returned to the aux2 data register. 1 0 1 0 a temperature measurement is made and the results returned to the temperature measurement 1 data register. 1 0 1 1 port scan function: battery input 1, battery input 2, auxiliary input 1, and a auxiliary input measurements are made and the results returned to the appropriate data registers. 1 1 0 0 a differential temperature measurement is made and the results returned to the temperature measurement 2 data register. 1 1 0 1 turn on x+, x drivers. 1 1 1 0 turn on y+, y drivers. 1 1 1 1 turn on y+, x drivers. table viii. a/d converter function select. psm read/write value description read 0 no screen touch detected read 1 screen touch detected write 0 conversions controlled by host write 1 conversions controlled by TSC2000 table v. psm bit operation. msb lsb bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 psm sts ad3 ad2 ad1 ad0 rs1 rs0 av1 av0 cl1 cl0 pv2 pv1 pv0 x table vi. a/d converter control register. rs1 rs0 function 0 0 12-bit resolution. power up and reset default. 0 1 8-bit resolution 1 0 10-bit resolution 1 1 12-bit resolution table ix. a/d converter resolution control. TSC2000 a/d converter control register (page 1, address 00 h ) the a/d converter in the TSC2000 is shared between all the different functions. a control register determines which input is selected, as well as other options. the result of the conversion is placed in one of the result registers in page 0 of memory, depending upon the function selected. the a/d converter control register controls several aspects of the a/d converter. the register is formatted as shown in table vi. bit 15: psm pen status/control mode. reading this bit allows the host to determine if the screen is touched. writing to this bit determines the mode used to read coordinates: host controlled, or under control of the TSC2000 responding to a screen touch. when reading, the pensts bit indicates if the pen is down or not. when writing to this register, this bit determines if the TSC2000 controls the reading of coordi- nates, or if the coordinate conversions are host-controlled. the default state is host-controlled conversions (0). bit 14: sts a/d converter status. when reading this bit indicates if the converter is busy, or if conversions are complete and data is available. writing a 0 to this bit will cause touch screen scans to continue until either the pen is lifted or the process is stopped. continuous scans or conver- sions can be stopped by writing a 1 to this bit. this will immediately halt a conversion (even if the pen is still down) and cause the a/d converter to power down. the default state is continuous conversions, but if this bit is read after a reset or power-up, it will read 1. bits [13:10]: ad3 C ad0 a/d converter function select bits. these bits control which input is to be converted, and what mode the converter is placed in. these bits are the same whether reading or writing. a complete listing of how these bits are used is shown in table viii. bits[9:8]: rs1, rs0 resolution control. the a/d converter resolution is specified with these bits. a description of these bits is shown in table ix. these bits are the same whether reading or writing.
16 www.ti.com TSC2000 sbas257 av1 av0 function 0 0 none 0 1 4 data averages 1 0 8 data averages 1 1 16 data averages table x. a/d conversion averaging control. cl1 cl0 function 0 0 8mhz internal clock rate 8-bit resolution only 0 1 4mhz internal clock rate 10-bit resolution only 1 0 2mhz internal clock rate. 1 1 1mhz internal clock rate. table xi. a/d converter clock control. msb lsb bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 dpdxxxxxxxxx x xxxxx table xiii. d/a converter control register. msb lsb bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 xxxxxxxxxx xintdl1dl0pdnrfv table xv. reference register. pv2 pv1 pv0 function 00 00 s stabilization time 0 0 1 100 s stabilization time 0 1 0 500 s stabilization time 0 1 1 1ms stabilization time 1 0 0 5ms stabilization time 1 0 1 10ms stabilization time 1 1 0 50ms stabilization time 1 1 1 100ms stabilization time table xii. panel voltage stabilization time control. dpd value description 0 d/a converter is powered and operational 1 d/a converter is powered down table xiv. dpd bit operation. int value description 0 external reference selected 1 internal reference selected table xvi. int bit operation. bits[7:6]: av1, av0 = converter averaging control. these two bits allow you to specify the number of averages the converter will perform, as shown in table x. note that when averaging is used, the sts bit and the dav output will indicate that the converter is busy until all conversions necessary for the averaging are complete. the default state for these bits is 00, selecting no averaging. these bits are the same whether reading or writing. bits[5:4]: cl1, cl0 = conversion clock control. these two bits specify the internal clock rate which the a/d converter uses when performing a single conversion, as shown in table xi. these bits are the same whether reading or writing. bits [3:1]: pv2 C pv0 = panel voltage stabilization time control. these bits allow you to specify a delay time from the time a pen touch is detected to the time a conversion is started. this allows you to select the appropriate settling time for the touch panel used. table xii shows the settings of these bits. the default state is 000, indicating a 0ms stabili- zation time. these bits are the same whether reading or writing. bit 0: this bit is not used, and is a don t care when writing. it will always read as a zero. d/a converter control register (page 1, address 02 h ) the single bit in this register controls the power down control of the on-board d/a converter. this register is formatted as shown in table xiii. bit 15: dpd = d/a converter power down. this bit controls whether the d/a converter is powered up and operational, or powered down. if the d/a converter is powered down, the a out pin will neither sink nor source current. reference register (page 1, address 03 h ) the TSC2000 has a register to control the operation of the internal reference. this register is formatted as shown in table xv. bit 4: int = internal reference mode. if this bit is written to a 1, the TSC2000 will use its internal reference; if this bit is a zero, the part will assume an external reference is being supplied. the default state for this bit is to select an external reference (0). this bit is the same whether reading or writing. bits [3:2]: dl1, dl0 = reference power-up delay. when the internal reference is powered up, a finite amount of time is required for the reference to settle. if measurements are made before the reference has settled, these measurements will be in error. these bits allow for a delay time for measure- ments to be made after the reference powers up, thereby assuring that the reference has settled. longer delays will be necessary depending upon the capacitance present at the ref pin (see typical characteristics). see table xvii for the delays. the default state for these bits is 00, selecting a 0ms delay. these bits are the same whether reading or writing.
17 www.ti.com TSC2000 sbas257 dl1 dl0 delay time 000 s 0 1 100 s 1 0 500 s 1 1 1000 s table xvii. reference power-up delay settings. pdn value description 0 internal reference is powered at all times 1 internal reference is powered down between conversions table xviii. pdn bit operation. int pdn reference behavior 0 0 external reference used, internal reference powered down 0 1 external reference used, interenal reference powered down 1 0 internal reference used, always powered up 1 1 internal reference used, will power up during conversions and then power down table xix. reference behavior possibilities. msb lsb bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 x x x x x x x x x x pre2 pre1 pre0 sns2 sns1 sns0 table xxi. configuration control register. pre[2:0] pre2 pre1 pre0 time 00 020 s 00 184 s 0 1 0 276 s 0 1 1 340 s 1 0 0 1.044ms 1 0 1 1.108ms 1 1 0 1.300ms 1 1 1 1.364ms table xxii. precharge times. sns[2:0] sns2 sns1 sns0 time 00 032 s 00 196 s 0 1 0 544 s 0 1 1 608 s 1 0 0 2.080ms 1 0 1 2.144ms 1 1 0 2.592ms 1 1 1 2.656ms table xxiii. sense times. rfv value description 0 1.25v reference voltage 1 2.5v reference voltage table xx. rfv bit operation. bit 1: pdn = reference power down. if a 1 is written to this bit, the internal reference will be powered down between conversions. if this bit is a zero, the internal reference will be powered at all times. the default state is to power down the internal reference, so this bit will be a 1. this bit is the same whether reading or writing. note that the pdn bit, in concert with the int bit, creates a few possibilities for reference behavior. these are detailed in table xix. bit 0: rfv = reference voltage control. this bit selects the internal reference voltage, either 1.25v or 2.5v. the default value is 1.25v. this bit is the same whether reading or writing. TSC2000 configuration control register (page 1, address 05 h ) this control register controls the configuration of the precharge and sense times for the touch detect circuit. the register is formatted as shown in table xxi. bits [5:3]: pre[2:0] = precharge time selection bits. these bits set the amount of time allowed for precharging any pin capacitance on the touch screen prior to sensing if a screen touch is happening. bits [2:0]: sns[2:0] = sense time selection bits. these bits set the amount of time the TSC2000 will wait to sense a screen touch between coordinate axis conversions in penirq -controlled mode.
18 www.ti.com TSC2000 sbas257 msb lsb bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 10111 011xx x xxxxx table xxiv. reset register. msb lsb bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 x x x x x x x x d7 d6 d5 d4 d3 d2 d1 d0 table xxvi. d/a converter register. reset register (page 1, address 04 h ) the TSC2000 has a special register, the reset register, which allows a software reset of the device. writing the code bbxx h , as shown in table xxiv, to this register will cause the TSC2000 to reset all its registers to their default, power-up values. writing any other values to this register will do nothing. reading this register or any reserved register will result in reading back all 1 s, or ffff h . TSC2000 data registers the data registers of the TSC2000 hold data results from conversions or keypad scans, or the value of the d/a converter output current. all of these registers default to 0000 h upon reset, except the d/a converter register, which is set to 0080 h , representing the midscale output of the d/a converter. x, y, z 1 , z 2 , bat1, bat2, aux1, aux2, temp1, and temp2 registers the results of all a/d conversions are placed in the appropri- ate data register, see tables iii and viii. the data format of the result word, r, of these registers is right-justified, as shown in table xxv. d/a converter data register (page 0, address 0b h ) the data to be written to the d/a converter is written into the d/a converter data register, which is formatted as shown in table xxvi. zero register (page 0, address 10 h ) this is a reserved data register, but instead of reading all 1 s (ffff h ), when read will return all 0 s (0000 h ). operation touch screen measurements as noted previously in the discussion of the a/d converter, several operating modes can be used, which allow great flexibility for the host processor. these different modes will now be examined. conversion controlled by TSC2000 initiated at touch detect in this mode, the TSC2000 will detect when the touch panel is touched and cause the penirq line to go low. at the same time, the TSC2000 will start up its internal clock. it will then turn on the y-drivers, and after a programmed panel voltage stabilization time, power up the a/d converter and convert the y-coordinate. if averaging is selected, several conversions may take place; when data averaging is complete, the y- coordinate result will be stored in the y-register. if the screen is still touched at this time, the x-drivers will be enabled, and the process will repeat, but instead measuring the x-coordinate and storing the result in the x-register. if only x- and y-coordinates are to be measured, then the conversion process is complete. see figure 8 for a flowchart for this process. the time it takes to go through this process depends upon the selected resolution, internal conversion clock rate, averaging selected, panel voltage stabilization time, and precharge and sense times. table xxv. result data format. msb lsb bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 0 0 0 0 r11 r10 r9 r8 r7 r6 r5 r4 r3 r2 r1 r0 msb lsb
19 www.ti.com TSC2000 sbas257 figure 8. x- and y-coordinate touch screen scan, initiated by touch. screen touch issue interrupt penirq go to host-controlled conversion touch screen scan x and y penirq initiated done done no no yes yes yes no no yes is data averaging done is screen touched is panel voltage stabilization done turn on drivers: y+, y start clock store y-coordinates in y-register power down a/d converter power up a/d converter reset penirq and scan trigger turn off clock convert y-coordinates is psm = 1 no yes no is screen touched is data averaging done no yes yes is panel voltage stabilization done convert x-coordinates turn on drivers: x+, x power up a/d converter store x-coordinates in x-register reset penirq and scan trigger power down a/d converter turn off clock issue data available the time needed to get a complete x/y-coordinate reading can be calculated by: (3) t 2.5 s + 2 t + t + t 2n n 1 f s coordinate pvs pre sns avg bits conv = ( ) +?+ ? ? ? ? ? ? 44 . where, t coordinate = time to complete x/y-coordinate reading t pvs = panel voltage stabilization time, see table xii t pre = precharge time, see table xxii t sns = sense time, see table xxiii n avg = number of averages, see table x; for no averag- ing, n avg = 1 n bits = number of bits of resolution, see table ix f conv = a/d converter clock frequency, see table xi if the pressure of the touch is also to be measured, the process will continue in the same way, but measuring the z 1 and z 2 values, and placing them in the z 1 and z 2 registers, see figure 9. as before, this process time depends upon the settings described above. the time for a complete x, y, z 1 , and z 2 coordinate reading is given by: (4) t 4.75 s + 3 t + t + t 4n n 1 f s coordinate pvs pre sns avg bits conv = ( ) +?+ ? ? ? ? ? ? 44 .
20 www.ti.com TSC2000 sbas257 figure 9. x-, y-, and z-coordinate touch screen scan, initiated by touch. screen touch issue interrupt penirq go to host-controlled conversion touch screen scan x, y, and z penirq initiated done no no yes yes yes no no yes is data averaging done is screen touched is panel voltage stabilization done turn on drivers: y+, y start clock store y-coordinates in y-register power down a/d converter power up a/d converter reset penirq and scan trigger turn off clock done reset penirq and scan trigger turn off clock convert y-coordinates is psm = 1 no yes is panel voltage stabilization done convert z 1 -coordinates turn on drivers: y+, x power up a/d converter no yes is data averaging done done no yes no is screen touched is data averaging done yes convert z 2 -coordinates store z 2 -coordinates in z 2 -register reset penirq and scan trigger power down a/d converter turn off clock issue data available is screen touched no yes yes is panel voltage stabilization done convert x-coordinates turn on drivers: x+, x power up a/d converter no is data averaging done store x-coordinates in x-register power down a/d converter store z 1 -coordinates in z 1 -register
21 www.ti.com TSC2000 sbas257 figure 10. x- and y-coordinate touch screen scan, initiated by host. screen touch issue interrupt penirq go to host-controlled conversion touch screen scan x and y host initiated done done no no yes yes no no yes is data averaging done is screen touched is panel voltage stabilization done turn on drivers: y+, y start clock reset penirq store y-coordinates in y-register power down a/d converter power up a/d converter reset penirq and scan trigger turn off clock convert y-coordinates is psm = 1 yes no is screen touched no yes is panel voltage stabilization done convert x-coordinates turn on drivers: x+, x power up a/d converter no yes is data averaging done store x-coordinates in x-register power down a/d converter turn off clock issue data available done host writes a/d converter control register conversion controlled by TSC2000 initiated by host responding to penirq in this mode, the TSC2000 will detect when the touch panel is touched and cause the penirq line to go low. the host will recognize the interrupt request, and then write to the a/d converter control register to select one of the touch screen scan functions. the conversion process then proceeds as described above, and as outlined in figures 10 through 14. the main difference between this mode and the previous mode is that the host, not the TSC2000, decides when the touch screen scan begins.
22 www.ti.com TSC2000 sbas257 figure 11. x-, y-, and z-coordinate touch screen scan, initiated by host. screen touch issue interrupt penirq go to host-controlled conversion touch screen scan x, y, and z host initiated done done no no yes yes no no yes is data averaging done is screen touched is panel voltage stabilization done turn on drivers: y+, y start clock reset penirq store y-coordinates in y-register power down a/d converter power up a/d converter reset penirq and scan trigger turn off clock done reset penirq and scan trigger turn off clock convert y-coordinates is psm = 1 no yes no is screen touched is data averaging done no yes yes is panel voltage stabilization done convert z 2 -coordinates convert z 1 -coordinates turn on drivers: y+, x power up a/d converter no yes is data averaging done store z 2 -coordinates in z 2 -register store z 1 -coordinates in z 1 -register power down a/d converter turn off clock issue data available is screen touched no yes yes is panel voltage stabilization done convert x-coordinates turn on drivers: x+, x power up a/d converter no yes no is data averaging done store x-coordinates in x-register power down a/d converter done host writes a/d converter control register
23 www.ti.com TSC2000 sbas257 figure 12. x-coordinate reading initiated by host. screen touch issue interrupt penirq go to host-controlled conversion touch screen scan x-coordinate host initiated done no reset penirq no yes are drivers on start clock no yes is panel voltage stabilization done turn on drivers: x+, x start clock power up a/d converter is psm = 1 convert x-coordinates no yes is data averaging done store x-coordinates in x-register power down a/d converter turn off clock issue data available done host writes a/d converter control register
24 www.ti.com TSC2000 sbas257 figure 13. y-coordinate reading initiated by host. screen touch issue interrupt penirq go to host-controlled conversion touch screen scan y-coordinate host initiated done no reset penirq start clock no is panel voltage stabilization done turn on drivers: y+, y no is data averaging done no yes yes yes are drivers on convert y-coordinates start clock power up a/d converter is psm = 1 store y-coordinates in y-register power down a/d converter turn off clock issue data available done host writes a/d converter control register
25 www.ti.com TSC2000 sbas257 figure 14. z-coordinate reading initiated by host. screen touch host writes a/d converter control register issue interrupt penirq go to host-controlled conversion touch screen scan z-coordinate host initiated no no yes yes yes no no is data averaging done is panel voltage stabilization done turn on drivers: y+, x start clock reset penirq store z 1 -coordinates in z 1 -register power up a/d converter are drivers on start clock convert z 1 -coordinates yes no is data averaging done store z 2 -coordinates in z 2 -register power down a/d converter issue data available convert z 2 -coordinates is psm = 1 done done turn off clock
26 www.ti.com TSC2000 sbas257 figure 15. x-coordinate reading controlled by host. screen touch issue interrupt penirq go to host-controlled conversion host-controlled x-coordinate no start clock reset penirq no is panel voltage stabilization done turn on drivers: x+, x turn on drivers: x+, x no yes yes yes no is data averaging done convert x-coordinates start clock power up a/d converter is psm = 1 are drivers on done done host writes a/d converter control register host writes a/d converter- control register done power down a/d converter turn off clock issue data available store x-coordinates in x-register conversion controlled by the host in this mode, the TSC2000 will detect when the touch panel is touched and cause the penirq line to go low. the host will recognize the interrupt request. instead of starting a sequence in the TSC2000 which then reads each coordinate in turn, the host now must control all aspects of the conver- sion. generally, upon receiving the interrupt request, the host will turn on the y-drivers. after waiting for the settling time, the host will then address the TSC2000 again, this time requesting an x-coordinate conversion. the process is then repeated for y- and z-coordinates. the processes are outlined in figures 15 through 17. the time needed to convert any single coordinate under host control (not including the time needed to send the command over the spi bus) is given by: (5) t 2.125 s + t n n 1 f s coordinate pvs avg bits conv = + ? + ? ? ? ? ? ? 44 .
27 www.ti.com TSC2000 sbas257 figure 16. y-coordinate reading controlled by host. screen touch issue interrupt penirq go to host-controlled conversion host-controlled y-coordinate no start clock reset penirq no is panel voltage stabilization done turn on drivers: y+, y turn on drivers: y+, y no yes yes yes no is data averaging done convert y-coordinate start clock power up a/d converter is psm = 1 are drivers on done done host writes a/d converter control register host writes a/d converter control register done power down a/d converter turn off clock issue data available store y-coordinates in y-register
28 www.ti.com TSC2000 sbas257 figure 17. z-coordinate reading controlled by host. screen touch issue interrupt penirq go to host-controlled conversion host-controlled z-coordinate no reset penirq no is panel voltage stabilization done turn on drivers: y+, x turn on drivers: y+, x no yes yes yes is data averaging done no is data averaging done convert z 1 -coordinates start clock start clock power up a/d converter is psm = 1 done done host writes a/d converter control register reset penirq host writes a/d converter control register done convert z 2 -coordinates no yes is data averaging done store z 2 -coordinates in z 2 -register power down a/d converter turn off clock issue data available store z 1 -coordinates in z 1 -register
29 www.ti.com TSC2000 sbas257 figure 18. functional block diagram of temperature mea- surement mode. figure 19. single temperature measurement mode. figure 20. additional temperature measurement for differ- ential temperature reading. host writes a/d converter control register start clock temperature input 2 done yes no is data averaging done store temperature input 2 in temp2 register power down a/d converter power up a/d converter power up reference convert temperature input 2 issue data available power down reference turn off clock host writes a/d converter control register start clock temperature input 1 done yes no is data averaging done store temperature input 1 in temp1 register power down a/d converter power up a/d converter power up reference convert temperature input 1 issue data available power down reference turn off clock a/d converter mux x+ temperature select temp1 temp2 operation temperature measurement in some applications, such as battery recharging, a measure- ment of ambient temperature is required. the temperature measurement technique used in the TSC2000 relies on the characteristics of a semiconductor junction operating at a fixed current level. the forward diode voltage (v be ) has a well-defined characteristic versus temperature. the ambient temperature can be predicted in applications by knowing the 25 c value of the v be voltage and then monitoring the delta of that voltage as the temperature changes. the TSC2000 offers two modes of temperature measurement. the first mode requires calibration at a known temperature, but only requires a single reading to predict the ambient tempera- ture. a diode, as shown in figure 18, is used during this measurement cycle. this voltage is typically 600mv at +25 c with a 20 a current through it. the absolute value of this diode voltage can vary a few millivolts; the temperature coefficient (tc) of this voltage is very consistent at 2.1mv/ c. during the final test of the end product, the diode voltage would be stored at a known room temperature, in system memory, for calibration purposes by the user. the result is an equivalent temperature measurement resolution of 0.3 c/lsb. this measurement of what is referred to as temperature 1 is illustrated in figure 19. the second mode does not require a test temperature calibration, but uses a two-measurement (differential) method to eliminate the need for absolute temperature calibration and for achieving 2 c/lsb accuracy. this mode requires a second conversion with a 91 times larger current. the voltage difference between the first (temp1) and second (temp2) conversion, using 91 times the bias current, will be represented by kt/q ln (n), where n is the current ratio = 91, k = boltzmann s constant (1.38054 10 -23 elec- trons volts/degrees kelvin), q = the electron charge (1.602189 10 -19 c), and t = the temperature in degrees kelvin. this method can provide much improved absolute temperature measurement, but less resolution of 2 c/lsb. the resultant equation for solving for k is: = ? ? k qv k ln(n) ? (6) where, ?= ( ) ? ( ) ( ) = ? = ?? ( ) ? vvi vi inmv k 2.573 v k/mv c 2.573 v mv 273 k 91 1 see figure 20 for the temperature 2 measurement.
30 www.ti.com TSC2000 sbas257 figure 21. battery measurement functional block diagram. figure 22. v bat1 measurement process. figure 23. v bat2 measurement process. host writes a/d converter control register start clock battery input 2 done yes no is data averaging done store battery input 2 in bat2 register power down a/d converter power up a/d converter power up reference convert battery input 2 issue data available power down reference turn off clock host writes a/d converter control register start clock battery input 1 done yes no is data averaging done store battery input 1 in bat1 register power down a/d converter power up a/d converter power up reference convert battery input 1 issue data available power down reference turn off clock v dd v bat1 7.5k ? 2.5k ? dc/dc converter battery 0.5v to 6.0v 0.125v to 1.5v 2.7v + operation battery measurement an added feature of the TSC2000 is the ability to monitor the battery voltage on the other side of a voltage regulator (dc/ dc converter), as shown in figure 21. the v bat1 input is divided down by 4 so that an input range of 0.5v to 6.0v can be measured. because of the division by 4, this input range would be represented as 0.125v to 1.5v to the a/d con- verter. the v bat2 input is divided down by 2, so it accommodates an input range of 0.5v to 3.0v, which is represented to the a/d converter as 0.25v to 1.5v. this smaller divider ratio allows for increased resolution. note that the v bat2 input pin can withstand up to 6v, but this input will only provide accurate measurements within the 0.5v to 3.0v range. for both battery inputs, the dividers are on only during the sampling of the battery input, in order to minimize power consumption. flowcharts which detail the process of making a battery input reading are shown in figures 22 and 23. the time needed to make temperature, auxiliary, or battery measurements is given by: (7) t 2.625 s + t n n 1 f s reading ref avg bits conv = + ? + ? ? ? ? ? ? 44 . where t ref is the reference delay time as given in table xvii.
31 www.ti.com TSC2000 sbas257 figure 24. aux1 measurement process. figure 25. aux2 measurement process. figure 26. port scan mode. host writes a/d converter control register start clock port scan done yes no is data averaging done yes no is data averaging done store battery input 1 in bat1 register power down a/d converter power up a/d converter power up reference convert battery input 1 store battery input 2 in bat2 register convert battery input 2 yes no is data averaging done yes no is data averaging done store auxiliary input 1 in aux1 register convert auxiliary input 1 store auxiliary input 2 in aux2 register convert auxiliary input 2 issue data available power down reference turn off clock host writes a/d converter control register start clock auxiliary input 2 done yes no is data averaging done store auxiliary input 2 in aux2 register power down a/d converter power up a/d converter power up reference convert auxiliary input 2 issue data available power down reference turn off clock host writes a/d converter control register start clock auxiliary input 1 done yes no is data averaging done store auxiliary input 1 in aux1 register power down a/d converter power up a/d converter power up reference convert auxiliary input 1 issue data available power down reference turn off clock operation auxiliary measurement the two auxiliary voltage inputs can be measured in much the same way as the battery inputs, as shown in figures 24 and 25. applications might include external temperature sensing, ambient light monitoring for controlling the back- light, or sensing the current drawn from the battery. operation port scan if making measurements of all the analog inputs (except the touch screen) is desired on a periodic basis, the port scan mode can be used. this mode causes the TSC2000 to sample and convert both battery inputs and both auxiliary inputs. at the end of this cycle, the battery and auxiliary result registers will contain the latest values. thus, with one write to the TSC2000, the host can cause four different measure- ments to be made. the flowchart for this process is shown in figure 26. the time needed to make a complete port scan is given by: t 7.5 s + t + 4n n 1 f 4.4 s reading ref avg bits conv = + ? ? ? ? ? ? ? (8)
32 www.ti.com TSC2000 sbas257 figure 27. d/a converter configuration. figure 28. d/a converter output current range versus rrng resistor value. 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10k 100k 1m 10m 100m i out (full-scale) (ma) arng resistor ( ? ) d/a converter v+ v bias a out arng rrng r2 r1 8 bits operation d/a converter the TSC2000 has an on-board 8-bit d/a converter, config- ured as shown in figure 27. this configuration yields a current sink (a out ) controlled by the value of a resistor connected between the arng pin and ground. the d/a converter has a control register, which controls whether or not the converter is powered up. the 8-bit data is written to the d/a converter through the d/a converter data register. this circuit is designed for flexibility in the output voltage at the v bias point shown in figure 27 to accommodate the widely varying requirements for lcd contrast control bias. v + can be a higher voltage than the supply voltage for the TSC2000. the only restriction is that the voltage on the a out pin can never go above the absolute maximum ratings for the device, and should stay above 1.5v for linear operation. the d/a converter has an output sink range which is limited to 1ma. this range can be adjusted by changing the value of rrng shown in figure 27. as this d/a converter is not designed to be a precision device, the actual output current range can vary as much as 20%. furthermore, the current output will change due to variations in temperature; the d/a converter has a temperature coefficient of approximately 2 a/ c. to set the full-scale current, rrng can be deter- mined from the graph shown in figure 28. for example, consider an lcd that has a contrast control voltage v bias that can range from 2v to 4v, that draws 400 a when used, and an available +5v supply. note that this is higher than the TSC2000 supply voltage, but it is within the absolute maximum ratings. the maximum v bias voltage is 4v, and this occurs when the d/a converter current is 0, so only the 400 a load current i load will be flowing from 5v to v bias . this means 1v will be dropped across r 1 , so r 1 = 1v/400 a = 2.5k ? . the minimum v bias is 2v, which occurs when the d/a converter current is at its full scale value, i max . in this case, 5v 2v = 3v will be dropped across r 1 , so the current through r 1 will be 3v/2.5k = 1.2ma. this current is i max + i load = i max + 400ua, so i max must be set to 800 a. looking at figure 28, this means that rrng should be around 1m ? . since the voltage at the a out pin should not go below 1.5v, this limits the voltage at the bottom of r 2 to be 1.5v minimum; this occurs when the d/a converter is providing its maximum current, i max . in this case, i max +i load flows through r 1 , and i max flows through r 2 . thus, r 2 i max + r 1 (i max + i load ) = 5v 1.5v = 3.5v we already have found r 1 = 2.5k ? , i max = 800 a, i load = 400 a, so we can solve this for r 2 and find that it should be 625 ? .
33 www.ti.com TSC2000 sbas257 figure 29. d/a converter circuit when using v + higher than v supply . d/a converter v+ v supply v bias a out arng rrng r 2 r 1 8 bits in the previous example, when the d/a converter current is zero, the voltage on the a out pin will rise above the TSC2000 supply voltage. this is not a problem, however, since v + was within the absolute maximum ratings of the TSC2000, so no special precautions are necessary. many lcd displays re- quire voltages much higher than the absolute maximum ratings of the TSC2000. in this case, the addition of an npn transistor, as shown in figure 29, will protect the a out pin from damage. result. such glitches might originate from switching power supplies, nearby digital logic, and high power devices. the degree of error in the digital output depends on the reference voltage, layout, and the exact timing of the external event. the error can change if the external event changes in time with respect to the scl input. with this in mind, power to the TSC2000 should be clean and well bypassed. a 0.1 f ceramic bypass capacitor should be placed as close to the device as possible. a 1 f to 10 f capacitor may also be needed if the impedance of the connection between +v dd and the power supply is high. a bypass capacitor is generally not needed on the reference pin because the reference is buffered by an internal op amp. if an external reference voltage originates from an op amp, make sure that it can drive any bypass capacitor that is used without oscillation. the TSC2000 architecture offers no inherent rejection of noise or voltage variation in regards to using an external reference input. this is of particular concern when the reference input is tied to the power supply. any noise and ripple from the supply will appear directly in the digital results. while high frequency noise can be filtered out, voltage variation due to line frequency (50hz or 60hz) can be difficult to remove. the gnd pin should be connected to a clean ground point. in many cases, this will be the analog ground. avoid connections which are too near the grounding point of a microcontroller or digital signal processor. if needed, run a ground trace directly from the converter to the power supply entry or battery connection point. the ideal layout will include an analog ground plane dedicated to the converter and associated analog circuitry. in the specific case of use with a resistive touch screen, care should be taken with the connection between the converter and the touch screen. since resistive touch screens have fairly low resistance, the interconnection should be as short and robust as possible. loose connections can be a source of error when the contact resistance changes with flexing or vibrations. as indicated previously, noise can be a major source of error in touch screen applications (e.g., applications that require a back-lit lcd panel). this emi noise can be coupled through the lcd panel to the touch screen and cause flickering of the converted data. several things can be done to reduce this error, such as utilizing a touch screen with a bottom-side metal layer connected to ground. this will couple the majority of noise to ground. additionally, filtering capacitors, from y+, y , x+, and x to ground, can also help. note, however, that the use of these capacitors will increase screen settling time and require longer panel voltage stabilization times, as well as increased precharge and sense times for the penirq circuitry of the TSC2000. layout the following layout suggestions should provide optimum performance from the TSC2000. however, many portable applications have conflicting requirements concerning power, cost, size, and weight. in general, most portable devices have fairly clean power and grounds because most of the internal components are very low power. this situation would mean less bypassing for the converter s power and less concern regarding grounding. still, each situation is unique and the following suggestions should be reviewed carefully. for optimum performance, care should be taken with the physical layout of the TSC2000 circuitry. the basic sar architecture is sensitive to glitches or sudden changes on the power supply, reference, ground connections, and digital inputs that occur just prior to latching the output of the analog comparator. therefore, during any single conversion for an n-bit sar converter, there are n windows in which large external transient voltages can easily affect the conversion
package option addendum www.ti.com 11-apr-2013 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) op temp (c) top-side markings (4) samples TSC2000ipw active tssop pw 20 70 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 TSC2000i TSC2000ipwg4 active tssop pw 20 70 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 TSC2000i TSC2000ipwr active tssop pw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 TSC2000i TSC2000ipwrg4 active tssop pw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 TSC2000i (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) multiple top-side markings will be inside parentheses. only one top-side marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire top-side marking for that device. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
package option addendum www.ti.com 11-apr-2013 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant TSC2000ipwr tssop pw 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 q1 package materials information www.ti.com 26-jan-2013 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) TSC2000ipwr tssop pw 20 2000 367.0 367.0 38.0 package materials information www.ti.com 26-jan-2013 pack materials-page 2
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per jesd46, latest issue, and to discontinue any product or service per jesd48, latest issue. buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all semiconductor products (also referred to herein as ? components ? ) are sold subject to ti ? s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in ti ? s terms and conditions of sale of semiconductor products. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. ti assumes no liability for applications assistance or the design of buyers ? products. buyers are responsible for their products and applications using ti components. to minimize the risks associated with buyers ? products and applications, buyers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which ti components or services are used. information published by ti regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of significant portions of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti components or services with statements different from or beyond the parameters stated by ti for that component or service voids all express and any implied warranties for the associated ti component or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of ti components in its applications, notwithstanding any applications-related information or support that may be provided by ti. buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. buyer will fully indemnify ti and its representatives against any damages arising out of the use of any ti components in safety-critical applications. in some cases, ti components may be promoted specifically to facilitate safety-related applications. with such components, ti ? s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. nonetheless, such components are subject to these terms. no ti components are authorized for use in fda class iii (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. only those ti components which ti has specifically designated as military grade or ? enhanced plastic ? are designed and intended for use in military/aerospace applications or environments. buyer acknowledges and agrees that any military or aerospace use of ti components which have not been so designated is solely at the buyer ' s risk, and that buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti has specifically designated certain components as meeting iso/ts16949 requirements, mainly for automotive use. in any case of use of non-designated products, ti will not be responsible for any failure to meet iso/ts16949. products applications audio www.ti.com/audio automotive and transportation www.ti.com/automotive amplifiers amplifier.ti.com communications and telecom www.ti.com/communications data converters dataconverter.ti.com computers and peripherals www.ti.com/computers dlp ? products www.dlp.com consumer electronics www.ti.com/consumer-apps dsp dsp.ti.com energy and lighting www.ti.com/energy clocks and timers www.ti.com/clocks industrial www.ti.com/industrial interface interface.ti.com medical www.ti.com/medical logic logic.ti.com security www.ti.com/security power mgmt power.ti.com space, avionics and defense www.ti.com/space-avionics-defense microcontrollers microcontroller.ti.com video and imaging www.ti.com/video rfid www.ti-rfid.com omap applications processors www.ti.com/omap ti e2e community e2e.ti.com wireless connectivity www.ti.com/wirelessconnectivity mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2013, texas instruments incorporated


▲Up To Search▲   

 
Price & Availability of TSC2000

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X